
17
Before the soldering iron is used to make a joint, the heated tip should be thoroughly cleaned on a damp
sponge and then "tinned" using rosin cored solder. For soldering delicate PCB assemblies, such as the
main PCB of the BBC Microcomputer, a good quality, rosin flux cored, 60% tin, 40% lead solder of 22
SWG should be used for both tinning the bit and soldering the components. To solder a joint, place the
fully heated tip of the soldering iron into position and allow the area to heat up for approximately two
seconds, before "feeding" in the cored solder. When the solder has flowed uniformly around the joint,
stop feeding in the solder and then remove the soldering iron. After the soldered joint has cooled, inspect
it to see that the solder has formed a good quality joint, which has a bright, shiny appearance. Dry-joints,
which are usually caused by insufficient heating of the joint or contaminants on the component leads, can
quite often be identified by their dull, matt appearance.
When soldering multi-leaded components such as integrated circuit sockets and some types of
connector, it is recommended that soldering is alternated between diagonally opposite pins, so that
localised overheating of the component and PCB is avoided.
2.5 Desoldering.
Occasionally, it will be necessary to desolder components or clear PCB holes which are blocked with
solder. This task can be successfully performed using a desolder pump, which should be available from
most electronic component stockists. Most desolder pumps consist of a spring loaded plunger inside a
cylindrical barrel. The spring is held compressed by a catch, which when released causes the plunger to
travel rapidly along the barrel, thus sucking the molten solder through the fine, heat resistant plastic
nozzle.
To remove excess solder using a desolder pump, firstly "arm" the pump by depressing and locking the
spring loaded plunger. Position the nozzle of the pump close to the solder to be removed and whilst
keeping your thumb positioned over the trigger button, melt the solder using a soldering iron. When the
solder is fully molten, depress the trigger button such that solder is sucked up into the barrel of the
desolder pump. The molten solder forms a pellet inside the barrel, which should be discarded by re-
arming the pump. This operation should not be carried out whilst the desolder pump is positioned over
the PCB, since the solder pellet or any solder flakes which have been formed can easily fall onto the
board, thus bridging tracks.
Содержание BBC A
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