HARDWARE SPECIFICATIONS
Figure 2: A TMD processing unit (left) and plastic enclosure (right)
Specification
Node
Processing Unit
Supply voltage
312 Volts
312 Volts
Current per node/PU (typical)
50 mA
50 mA
Power per node/PU (typical at 6V)
300 mW
300 mW
Integration contacts
None
Normally closed relays and GPIOs for
both motion and trouble, USB serial out
Max RF transmit power
4.5 dBm
4.5 dBm
RF frequency
Minimum: 2.403 GHz
Maximum: 2.480 GHz
Channel bandwidth: 5MHz
Number of channels: 16
Minimum: 2.403 GHz
Maximum: 2.480 GHz
Channel bandwidth: 5MHz
Number of channels: 16
Plastic enclosure dimensions
1.5 x 3.0 x 0.5 (inches)
1.5 x 3.0 x 0.5 (inches)
Table 1: Xandem TMD specifications.
Copyright © 2015 XANDEM
TMD User Guide (Rev C.2) Page 6
