Section 3.1 Service
M I C R O T Y M P 1 T R O U B L E S H O O T I N G
5. With a soldering iron and solder reflow the solder that connects the blue and yellow wires to the data
contacts. CAUTION: Applying too much heat will cause the housing to melt. Assemble stand and
check. If the problem still exists, go on to the next step.
6. Check the data contacts for any interference that may be caused by the pad (see fig. page 17). If there
is, disassemble stand to step #4 (removing the circuit boards, page 6). Pull out the pad and replace
with a new one, ensuring there is clearance between pad and data contacts, assemble stand and check
operation.
pg 37
Summary of Contents for Micro Tymp 1
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