SARA-G450 - System integration manual
UBX-18046432 - R08
Design-in
Page 87 of 143
C1-Public
2.5.1.3
Guidelines for single SIM chip connection
An application circuit for the connection to a single solderable SIM chip (M2M UICC Form Factor) is
described in
, where the optional SIM detection feature is not implemented (see the circuit
described in
if the SIM detection feature is required).
Follow these guidelines connecting the module to a solderable SIM chip without SIM presence
detection:
Connect the UICC / SIM contact C1 (VCC) to the VSIM pin of the module.
Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module.
Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module.
Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module.
Connect the UICC / SIM contact C5 (GND) to GND.
Provide a 1
µ
F bypass capacitor (e.g. Murata GRM155R70J105K) at the SIM supply line (VSIM)
close to the related pad of the SIM chip, to prevent digital noise.
Provide a bypass capacitor of about 22 pF to 33 pF (e.g. Murata GRM1555C1H330J) on each SIM
line (VSIM, SIM_CLK, SIM_IO, SIM_RST), to prevent RF coupling especially in case the RF antenna
is placed closer than 10 – 30 cm from the SIM chip.
Limit capacitance and series resistance on each SIM signal (SIM_CLK, SIM_IO, SIM_RST) to
match the requirements for the SIM interface regarding maximum allowed rise time on the lines.
1:1 scaling
41
VSIM
39
SIM_IO
38
SIM_CLK
40
SIM_RST
4
V_INT
42
SIM_DET
SIM CHIP
SIM chip
bottom view
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3
C5
U1
C4
2
8
3
6
7
1
C1
C5
C2
C6
C3
C7
C4
C8
8
7
6
5
1
2
3
4
TP
SARA-G450
Figure 44: Application circuit for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference
Description
Part number – Manufacturer
C1, C2, C3, C4
33 pF capacitor ceramic C0G 0402 5% 50 V
GRM1555C1H330JA01 – Murata
C5
1
µ
F capacitor ceramic X7R 0402 10% 16 V
GRM155R70J105KA12 – Murata
U1
SIM chip (M2M UICC Form Factor)
Generic manufacturer
Table 29: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented
