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NINA-B50 series - Hardware integration manual

UBX-22021116 - R02

Design-in

Page 28 of 57

C1-Public

The suggested stencil layout for NINA-B501 is to follow the copper pad layout, as shown in

Figure 11: Recommended footprint for NINA-B501 (bottom view)

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Summary of Contents for NINA-B50 Series

Page 1: ...towards hardware and software engineers this document describes how to integrate NINA B50 series stand alone Bluetooth 5 3 Low energy module in an application product It explains the hardware design...

Page 2: ...Document contains the final product specification This document applies to the following products Product name Document status NINA B501 Advance information NINA B506 Advance information For informati...

Page 3: ...k RTC 13 2 3 Antenna integration 14 2 3 1 Antenna solutions 14 2 3 2 Approved antenna designs 15 2 4 Data interfaces 15 2 4 1 Low Power Universal Asynchronous Receiver Transmitter LPUART 15 2 4 2 Low...

Page 4: ...shing over the serial interfaces 34 4 4 3 Loading NBU Narrow Band Unit firmware into the module 34 4 5 Secure boot 36 5 Handling and soldering 37 5 1 ESD handling precautions 37 5 2 Packaging shipping...

Page 5: ...6 6 1 Taiwan NCC Warning Statement 47 6 6 2 Labeling requirements for end product 47 6 7 KCC South Korea compliance 47 6 8 Australia and New Zealand regulatory compliance 48 6 9 Safety compliance 48...

Page 6: ...ariants when designing the host platform 1 1 Module architecture NINA B50 series modules integrate internal power management circuitry that requires only a single supply voltage in the range of 1 71 3...

Page 7: ...NINA B50 series Hardware integration manual UBX 22021116 R02 Product overview Page 7 of 57 C1 Public 1 2 Block diagram Figure 1 Block diagram of NINA B50 series...

Page 8: ...ustomer applications to run on the module itself without any need for a supporting host MCU The module supports Bluetooth 5 3 Low Energy LE and 802 15 4 with Thread Matter and Zigbee NINA B50 series m...

Page 9: ...um flexibility for developing similar devices with various radio technologies 2 1 Power Supply 2 1 1 Power switch series modules have an on module power switch which can be used to switch off all or p...

Page 10: ...make sure that the AC ripple voltage is kept as low as possible at the switching frequency Design layouts should focus on minimizing the impact of any high frequency ringing Use an LDO linear regulat...

Page 11: ...upport two power supply configurations Power efficient configuration Power switch configuration A voltage level less than 3 V on VCC and VCC_IO has negative impact on Tx output power The on module pow...

Page 12: ...pecific parts of the module can be powered off when they are not needed and complex wake up events can be generated from different external and internal inputs NINA B50 series modules support followin...

Page 13: ...ted from the rest of the chip but continues to increment the time counter if enabled and retain the state of the RTC registers The RTC registers are not accessible The time counter can generate multip...

Page 14: ...al antenna to the NINA B501 module The antenna could be either o An antenna external to the end product typically used in end products with a metal enclosure o An antenna external to the NINA B501 mod...

Page 15: ...installer must certify the design with respective regulatory agencies 2 4 Data interfaces 2 4 1 Low Power Universal Asynchronous Receiver Transmitter LPUART NINA B50 series modules support two LPUART...

Page 16: ...ructions and data on the SDA signal I2C 2 wire pin configuration o SCL Clock output in Main node input in Sub node o SDA Data input output pin I2C 4 wire pin configuration o SCL Clock input pin o SDA...

Page 17: ...to indicate rotation of a mechanical shaft in either a positive or negative direction The QDEC uses two inputs channel 0 PHASE_A and channel 1 PHASE_B to control incremental and decremental counting i...

Page 18: ...ries modules the SWD interface is used as the external connection interface of DAP 2 7 3 SWO NINA B50 supports a 1 bit Serial Wire Output SWO trace port for efficiently accessing core trace informatio...

Page 19: ...antee for correct boot up and system operation Ensure that the voltage level is correctly defined during module boot It is important to follow the schematic and layout design recommendations described...

Page 20: ...tions on a PCB where Frequency 2 4 GHz Wavelength 12 5 cm Quarter wavelength 3 5 cm in free space or 1 5 cm on a FR4 substrate PCB Choose antennas with optimal radiating performance in the operating b...

Page 21: ...on the top layer Thickness of the copper layer T can also be represented by Base Copper Weight which is commonly used as the parameter for PCB stack up Dielectric constant r defines the ratio between...

Page 22: ...component on RF traces 3 2 3 NINA B501 NINA B501 is suited for designs that due to mechanical integration or placement of the module require an external antenna At the beginning of the design phase w...

Page 23: ...er 1 right The following recommendations apply for proper layout of the connector Strictly follow the connector manufacturer s recommended layout o SMA Pin Through Hole connectors require a void GND k...

Page 24: ...losure Metal casings or plastics that include metal flakes should not be used Metallic based paints and lacquers should also be avoided 3 2 4 1 Internal PCB trace antenna For optimal operating perform...

Page 25: ...the ground plane on both sides of the module and the antenna keep out area on all layers Figure 9 Extended host ground plane outside NINA B506 Figure 10 shows a scaled image of the board that details...

Page 26: ...a and follow the recommendations from the antenna manufacturer to determine the safe distance between the antenna and any other part of the system Designers should also maximize the distance between t...

Page 27: ...needs to be changed add an adequate number of GND vias in the area in which the layer is switched This is necessary to provide a low impedance path between the two GND layers for the return current Do...

Page 28: ...ntegration manual UBX 22021116 R02 Design in Page 28 of 57 C1 Public The suggested stencil layout for NINA B501 is to follow the copper pad layout as shown in Figure 11 Figure 11 Recommended footprint...

Page 29: ...llow Detail A and Detail B dimensions mentioned in Figure 11 Figure 12 Recommended footprint for NINA B506 bottom view 3 5 Thermal guidelines NINA B50 series modules are designed to operate in a speci...

Page 30: ...rective 89 336 EEC and the Low Voltage Directive 73 23 EEC issued by the Commission of the European Community Compliance with the above directives implies conformity to the following European Norms fo...

Page 31: ...roperly implemented Adequate bypassing is included in front of each power pin Each signal group is consistent with its own power rail supply or proper signal translation has been provided Configuratio...

Page 32: ...Xpresso SDK toolchain and examples 1 Download and extract the MCUXpresso SDK from the MCUXpresso SDK Builder 2 Download and install the latest MCUXpresso IDE 3 Every time MCUXpresso IDE launches it pr...

Page 33: ...ustomer if using external 32 kHz crystal u blox type number 16 u blox serial number 8 Table 8 Production parameters stored on NINA B50 The parameters are stored in the PROD_DATA_BASE_ADDR register Exa...

Page 34: ...h NINA B50 modules EVK NINA B50 incorporates an onboard debugger which means that it can be flashed without an external debugger Always make a note of your Bluetooth device address before starting the...

Page 35: ...l 1 or On the EVK NINA B5 remove the jumper at J19 9 10 and connect a wire between 3V3 and J19 9 before powering up the evaluation board as shown in Figure 15 During power up the board enters ROM boot...

Page 36: ...sb file 1 1 100 Completed Successful generic response to command receive sb file Response status 0 0x0 Success Wrote 194240 of 194240 bytes 6 Power cycle the board 4 5 Secure boot The NINA B50 module...

Page 37: ...contact must always be to local GND Before mounting an antenna patch connect the device to ground When handling the RF pin do not touch any charged capacitors Be especially careful when handling mate...

Page 38: ...profile is dependent on the thermal mass over the entire area of the fully populated host PCB the heat transfer efficiency of the oven and the type of solder paste that is used The optimal soldering...

Page 39: ...soldered on it Boards with combined through hole technology THT components and surface mount technology SMT devices may require wave soldering to solder the THT components Only a single wave solderin...

Page 40: ...dio module of u blox or any other manufacturer 6 2 European Union regulatory compliance Approvals are pending for NINA B501 and NINA B506 For information about the regulatory compliance of NINA B50 se...

Page 41: ...0 series modules have been evaluated against the essential requirements of the Radio Equipment Regulations 2017 SI 2017 No 1206 as amended by SI 2019 No 696 Guidance about using the UKCA marking https...

Page 42: ...share the module installation instructions to the end user of the end product host device Any changes or modifications NOT explicitly APPROVED by u blox AG may invalidate compliance with FCC rules par...

Page 43: ...fulfil the requirements of the SAR evaluation Exemption limits defined in RSS 102 issue 5 an OEM integrator implementing NINA B50 Bluetooth LE capability into an end product must ensure a separation...

Page 44: ...e d encompromettre le fonctionnement 6 4 5 End product labeling requirements 6 4 5 1 ISED Compliance The host product shall be properly labelled to identify the modules within the host product The Inn...

Page 45: ...nd the statement shall also be included in the end product manual 6 4 6 End product compliance 6 4 6 1 General requirements Any changes to hardware hosts or co location configuration may require new r...

Page 46: ...g from the u blox reference design and new antenna types are added under a Class II Permissive Change Integrators who want to refer to the u blox FCC ID IC certification ID should contact their local...

Page 47: ...Telecommunications Act The low power radio frequency devices must accept interference from legal communications or ISM radio wave radiated devices 6 6 2 Labeling requirements for end product End prod...

Page 48: ...espective support team at the local mail address in your region To meet the overall Australian and or New Zealand end product compliance standards the integrator must create a compliance folder contai...

Page 49: ...U FL to Reverse Polarity SMA adapter cable Connector U FL and Reverse Polarity SMA jack outer thread and pin Impedance 50 Minimum cable loss 0 5 dB The cable loss must be above the minimum cable loss...

Page 50: ...0 x 28 0 mm Type Monopole Connector Reverse Polarity SMA plug inner thread and pin receptacle Comment The antenna adapter cable UF L part must be mounted on a metal ground plane for best performance T...

Page 51: ...n Polarization Vertical Gain 3 0 dBi Impedance 50 Size 9 4 x 70 5 mm Type Monopole Cable length 100 mm Connector U FL connector Comment To be mounted with a U FL connector For information on how to in...

Page 52: ...est report for each unit can be generated Figure 20 shows the ATE typically used during u blox production u blox in line production testing includes Digital self tests firmware download MAC address pr...

Page 53: ...Device The standard operational module firmware and test software on the host can be used to perform functional tests communication with the host controller check interfaces and perform basic RF perf...

Page 54: ...put Output I2C Inter Integrated Circuit IDE Integrated Development Environment IEEE Institute of Electrical and Electronics Engineers LDO Low Drop Out LED Light Emitting Diode MAC Media Access Control...

Page 55: ...et of Things IoT smart home automation devices to communicate on a local wireless mesh network THT Through Hole Technology TXD Transmit Data UART Universal Asynchronous Receiver Transmitter UICR User...

Page 56: ...tatic phenomena General requirements 12 ETSI EN 60950 1 2006 Information technology equipment Safety Part 1 General requirements 13 JESD51 Overview of methodology for thermal testing of single semicon...

Page 57: ...configuration and Power switch configurations in Power supply configuration section Updated Power modes section Revised sections describing Data interfaces Other Digital interfaces Analog interfaces...

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