NINA-B50 series - Hardware integration manual
UBX-22021116 - R02
Handling and soldering
Page 38 of 57
C1-Public
5.3
Reflow soldering process
NINA-B50 series modules are surface mounted devices supplied in a Land Grid Array (LGA) package
with gold-plated solder lands. The modules are manufactured in a lead-free process with lead-free
soldering paste.
The thickness of solder resist between the host PCB top side and the bottom side of the module must
be considered for the soldering process.
NINA-B50 modules are compatible with the industrial reflow profile for common SAC type RoHS
solders. No-clean soldering paste is strongly recommended.
The reflow profile is dependent on the thermal mass over the entire area of the fully populated host
PCB, the heat transfer efficiency of the oven, and the type of solder paste that is used. The optimal
soldering profile that is used must be trimmed for each case depending on the specific soldering
process and PCB layout.
⚠
The target values shown in
are only general guidelines for a Pb-free process. For further
information, see also the JEDEC J-STD-020C standard
Process parameter
Unit
Target
Pre-heat
Ramp up rate to T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from +25 °C)
s
150
t
S
(Pre-heat)
s
60 to 120
Peak
T
L
°C
217
t
L
(time above T
L
)
s
40 to 60
T
P
(absolute max)
°C
245
Cooling
Ramp-down from T
L
K/s
4
Allowed soldering cycles
-
1
Table 9: Recommended reflow profile
Figure 17: Reflow profile
☞
Lower value of T
P
and slower ramp down rate (2
–
3 °C/sec) is preferred.
