User's Manual l TQMaRZG2x UM 0100 l © 2021, TQ-Systems GmbH
Page 41
8.
APPENDIX
8.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 44:
Acronyms
Acronym
Meaning
ARM
®
Advanced RISC Machine
ASCII
American Standard Code for Information Interchange
BGA
Ball Grid Array
BIOS
Basic Input/Output System
BSP
Board Support Package
CAN-FD
Controller Area Network Flexible Data-Rate
CPU
Central Processing Unit
CSI
Camera Serial Interface
DDR4
Double Data Rate 4
DIN
Deutsche Industrienorm (German industry standard)
DU
Display Unit
ECC
Error Checking and Correction
EEPROM
Electrically Erasable Programmable Read-only Memory
EMC
Electromagnetic Compatibility
eMMC
embedded Multi-Media Card
EN
Europäische Norm (European standard)
ESD
Electrostatic Discharge
EuP
Energy using Products
FD
Flexible Data-Rate
FR-4
Flame Retardant 4
GPIO
General-Purpose Input/Output
HDMI
High-Definition Multimedia Interface
HSCIF
High-speed Serial Communication Interface
I
2
C
Inter-Integrated Circuit
IIC
Inter-Integrated Circuit
IO
Input/Output
IP00
Ingress Protection 00
IPL
Initial Program Loader
JTAG
®
Joint Test Action Group
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LPDDR4
Low-Power Double Data Rate 4
LVDS
Low Voltage Differential Signal
MAC
Media Access Control
MIPI
Mobile Industry Processor Interface
MLC
Multi-Level Cell
MMC
Multimedia Card
MOZI
Modulzieher (module extractor)
MTBF
Mean (operating) Time Between Failures
