User's Manual l MBa57xx UM 0100 l © 2020, TQ-Systems GmbH
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10.
APPENDIX
10.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 59:
Acronyms
Acronym
Meaning
ADR
Accord européen relatif au transport international des marchandises Dangereuses par Route
BGA
Ball Grid Array
BIOS
Basic Input/Output System
BSP
Board Support Package
CAN
Controller Area Network
CPU
Central Processing Unit
CSI
Camera Serial Interface
DIN
German industry standard (Deutsche Industrienorm)
DIP
Dual In-line Package
DSP
Digital Signal Processor
ECC
Error Checking and Correction
EEPROM
Electrically Erasable Programmable Read-Only Memory
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
eMMC
embedded Multi-Media Card
EN
Europäische Norm (European Standard)
ESD
Electro-Static Discharge
EuP
Energy using Products
FFC
Flat Flex Cable
FR-4
Flame Retardant 4
GPIO
General Purpose Input/Output
GPMC
General-Purpose Memory Controller
HDMI
High Definition Multimedia Interface
HSIC
High-Speed Inter-Chip
I/O
Input/Output
I
2
C
Inter-Integrated Circuit
I
2
S
Inter-IC Sound
IEEE
®
Institute of Electrical and Electronics Engineers
IP00
Ingress Protection 00
JTAG
®
Joint Test Action Group
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LVDS
Low Voltage Differential Signal
MII
Media-Independent Interface
MOZI
Module extractor (Modulzieher)
mPCIe
Mini PCIe
MTBF
Mean operating Time Between Failures
