User's Manual l MBa57xx UM 0100 l © 2020, TQ-Systems GmbH
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5.
SOFTWARE
The software required for the HSIC hub can, depending on the configuration, be loaded by the TQMa57xx software, see 4.2.1.
Further software is not required for the MBa57xx.
6.
MECHANICS
6.1
Dimensions
The MBa57xx has overall dimensions (length × width) of 230 × 170 mm
2
.
The MBa57xx has a maximum height of approximately 26.4 mm.
The MBa57xx has six 3.2 mm holes for mounting in a housing and four 3.2 mm holes for mounting a heat sink.
The MBa57xx weighs approximately 295 grams without TQMa57xx.
To avoid damage due to mechanical stresses, the TQMa57xx may only be removed from the carrier board by using the extraction
tool MOZIa57xx. This extraction tool can be purchased separately.
Note:
Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMa57xx
for the extraction tool MOZIa57xx.
6.2
Thermal management
For cooling the MBa57xx and the TQMa57xx, up to 8.4 W must be dissipated if no other devices are connected.
Further power dissipation may occur at additionally connected loads, e.g. MBa57xx pin headers, PCIe slot, etc.
The user is responsible for the dissipation of this power in his application.
Attention:
Destruction or malfunction, TQMa57xx heat dissipation
The AM57xx belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the AM57xx must be taken into
consideration when connecting the heat sink, see (10).
The AM57xx is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa57xx and thus malfunction, deterioration or destruction.
