SLOS787H – MAY 2012 – REVISED APRIL 2014
8
Device and Documentation Support
8.1
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's
.
TI's Engineer-to-Engineer (E2E) Community.
Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow
engineers.
8.2
Trademarks
MSP430 is a trademark of Texas Instruments.
ARM is a registered trademark of ARM Limited.
MIFARE is a trademark of NXP Semiconductors.
FeliCa is a trademark of Sony Corporation.
All other trademarks are the property of their respective owners.
8.3
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.4
Glossary
—
TI Glossary
.
This glossary lists and explains terms, acronyms and definitions.
9
Mechanical Packaging and Orderable Information
9.1
Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2012–2014, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
73
Product Folder Links: