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PACKAGE OUTLINE
C
A
A
32X 0.3
0.2
3.45 0.1
32X 0.5
0.3
0.9 MAX
(0.2) TYP
0.05
0.00
28X 0.5
2X
3.5
2X 3.5
0.05
0.08
A
5.1
4.9
B
5.1
4.9
VQFN - 0.9 mm max height
RHB0032N
PLASTIC QUAD FLATPACK - NO LEAD
4222893/A 04/2016
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
8
17
24
9
16
32
25
(OPTIONAL)
PIN 1 ID
0.1
C A B
0.05
C
EXPOSED
THERMAL PAD
33
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SECTION A-A
TYPICAL
SCALE 3.000
A-A 30.000