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Processor Family
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
MCU Platform
430 = MSP430 low-power microcontroller platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Bluetooth
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range
S = 0°C to 50 C
C to 70 C
I = 40 C to 85 C
T = –40 C to 105 C
°
C = 0°
°
–
°
°
°
°
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features
-EP = Enhanced Product ( 40°C to 105°C)
-HT = Extreme Temperature Parts ( 55°C to 150°C)
-Q1 = Automotive Q100 Qualified
–
–
MSP
430
F
5
438
A
I
ZQW
T
-EP
Processor Family
Series
Optional: Temperature Range
MCU Platform
Packaging
Device Type
Optional: A = Revision
Optional: Tape and Reel
Feature Set
Optional: Additional Features
65
MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233
MSP430G2403, MSP430G2303, MSP430G2203
www.ti.com
SLAS734G – APRIL 2011 – REVISED APRIL 2016
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MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303
MSP430G2203
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Figure 7-1. Device Nomenclature