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MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233
MSP430G2403, MSP430G2303, MSP430G2203
www.ti.com
SLAS734G – APRIL 2011 – REVISED APRIL 2016
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MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303
MSP430G2203
Specifications
Copyright © 2011–2016, Texas Instruments Incorporated
(1)
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
•
Keep the trace between the device and the crystal as short as possible.
•
Design a good ground plane around the oscillator pins.
•
Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
•
Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
•
Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
•
If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
•
Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(2)
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, verify the correct load by measuring the ACLK frequency. For a correct setup, the
effective load capacitance should always match the specification of the used crystal.
(3)
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(4)
Measured with logic-level input frequency but also applies to operation with crystals.
5.22 Crystal Oscillator, XT1, Low-Frequency Mode
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V
CC
MIN
TYP
MAX
UNIT
f
LFXT1,LF
LFXT1 oscillator crystal
frequency, LF mode 0, 1
XTS = 0, LFXT1Sx = 0 or 1
1.8 V to 3.6 V
32768
Hz
f
LFXT1,LF,logic
LFXT1 oscillator logic level
square-wave input frequency,
LF mode
XTS = 0, XCAPx = 0, LFXT1Sx = 3
1.8 V to 3.6 V
10000
32768
50000
Hz
OA
LF
Oscillation allowance for
LF crystals
XTS = 0, LFXT1Sx = 0,
f
LFXT1,LF
= 32768 Hz, C
L,eff
= 6 pF
500
k
Ω
XTS = 0, LFXT1Sx = 0,
f
LFXT1,LF
= 32768 Hz, C
L,eff
= 12 pF
200
C
L,eff
Integrated effective load
capacitance, LF mode
(2)
XTS = 0, XCAPx = 0
1
pF
XTS = 0, XCAPx = 1
5.5
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
11
Duty cycle, LF mode
XTS = 0, Measured at P2.0/ACLK,
f
LFXT1,LF
= 32768 Hz
2.2 V
30%
50%
70%
f
Fault,LF
Oscillator fault frequency,
LF mode
(3)
XTS = 0, XCAPx = 0, LFXT1Sx = 3
(4)
2.2 V
10
10000
Hz
5.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
T
A
V
CC
MIN
TYP
MAX
UNIT
f
VLO
VLO frequency
–40°C to 85°C
3 V
4
12
20
kHz
df
VLO
/d
T
VLO frequency temperature drift
–40°C to 85°C
3 V
0.5
%/°C
df
VLO
/dV
CC
VLO frequency supply voltage drift
25°C
1.8 V to 3.6 V
4
%/V
5.24 Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V
CC
MIN
TYP
MAX
UNIT
f
TA
Timer_A input clock frequency
SMCLK, duty cycle = 50% ±10%
f
SYSTEM
MHz
t
TA,cap
Timer_A capture timing
TA0, TA1
3 V
20
ns
