TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.
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4. Processor Heat sink Module (PHM) Sub-Assemblyfor Factory and Field Replaceable Unit (FRU)
4.4.5 PHM Assembly to Socket
Align Pin 1 indicators on processor/carrier to bolster plate.
Holding PHM horizontal, carefully lower vertically to engage PHM to bolster plate’s alignment pins.
Verify PHM is sitting horizontally over bolster plate assembly.
Instruction Sheet
411-115008 Rev.A
20th Mar’20