TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.
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4. Processor Heat sink Module (PHM) Sub-Assembly for Factory and Field Replaceable Unit (FRU)
4.2.4 Processor Carrier Assembly Inspection
Verify that the processor is securely latched to the processor carrier. The processor carrier should be flat
and level to the processor top. If the processor carrier is not latched properly, press the processor carrier
down as outlined in section 4.2.3.
Instruction Sheet
411-115008 Rev.A
20th Mar’20
