TE Connectivity Confidential & Proprietary. Do not reproduce or distribute.
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4. Processor Heat sink Module (PHM) Sub-Assemblyfor Factory and Field Replaceable Unit (FRU)
4.5.7 Breaking the Thermal Interface Material
Place the PHM onto a flat surface.
Place thumb and finger on the side of the carrier in the middle and lift up on the TIM break lever to release the
Processor Package from the TIM and carrier.
Instruction Sheet
411-115008 Rev.A
20th Mar’20
