TAJIMA TLMX Series, User Manual

Page: 266 / 318

To set details of optional device
251
Chapter 9
1
2
3
4
5
6
7
8
9
10
11
12
RR12
2-2. Sequin Device IV
The detail of the device will be set.
2-2-1. Explanation on the screen
[a]
Feed amount of sequin chips of device at left side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[b] Feed amount of sequin chips of the device at the right side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[c]
Insertion of jump data when a sequin chip is sewn on
Select "YES" when sequin chips are not sewn effectually. However, productivity will be
decreased.
YES: To perform
NO: Not to perform
[d]
Moving up of device at frame stepping
YES: To perform
NO: Not to perform
[e] This setting feeds sequin chips one by one. ( → p.250)
The feed amount is the value selected at [a] or [b] described above.
L: Left device
R: Right device
Selecting "NO" will increase manufacturing efficiency. However, the device
could interfere with the frame resulting in its breakage depending on design or
frame type to use.
F3
2 Sequin
NO
YES/NO
Jump Insertion
YES
Device Up at Frame stepping YES/NO
4.0
4.0
Sequin (L)
Sequin (R)
[mm] 2.0 23.0
[mm] 2.0 23.0
[a]
Setting of device at right side
[b] Setting of device at the right side
[c] Jump Insertion
[d]
Moving up of device
Sequin Chip Feed
[h]
To feed sequin chips one by one
!
CAUTION