Sony HCD-MD555, Service Manual

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HCD-MD555
7-2. CIRCUIT BOARDS LOCATION
— 61 — — 62 —
LED board
POWER KEY board
TRANS-C board
TRANS-B board
TRANS-A board
RDS board (AEP, UK)
TUNER board
PANEL board
ENCORDER board (B)
ENCORDER board (A)
WM board
MAIN board
HP board
HEAD RELAY board
ELEVATOR RELAY board
MECH RELAY board
SW board
SP board
REG board
HEAD SW board
TRANS-D board (JE, HK, SP, MY)
IN SW board
CONNECTOR board
SENSOR board
SENSOR 2 board
LOAD MOTOR board
CLAMP MOTOR board
AMP board
DISC SW board
BD (CD) board
BD (MD) board
INT/COUNT SW board
OUT SW board
Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and 1 /
4
W or less unless otherwise
specified.
• % : indicates tolerance.
• ¢ : internal component.
•
2
: nonflammable resistor.
• 1 : fusible resistor.
• C : panel designation.
•
U
: B+ Line.
•
V
: B– Line.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER
J : CD PLAY
d : MD PLAY
E
: MD REC (ANALOG)
a
: MD REC (DIGITAL)
• Abbreviation
SP : Singapore model.
MY : Malaysia model.
JE : Tourist model.
HK : Hong Kong model.
Note: The components identified by mark ! or dotted line
with mark ! are critical for safety.
Replace only with part number specified.
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
• ® : Through hole.
•
¢ : internal component.
• b : Pattern of the rear side.