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Table for differences of function
Model
DSC-P30
DSC-P50
CCD Imager
1.3M pixels
2.1M pixels
1. Check the area of your repair for unsoldered or poorly-sol-
dered connections. Check the entire board surface for solder
splashes and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transis-
tors, that were installed during a previous repair. Point them
out to the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recom-
mend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of
the circuit board (within 3 times).
•
Be careful not to apply force on the conductor when sol-
dering or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
