NOTICE
Damage through electric fields or electrostatic discharge
Electric fields or electrostatic discharge can cause malfunctions through damaged individual
components, integrated circuits, modules or devices.
● Only pack, store, transport and send electronic components, modules or devices in their
original packaging or in other suitable materials, e.g conductive foam rubber of aluminum
foil.
● Only touch components, modules and devices when you are grounded by one of the
following methods:
– Wearing an ESD wrist strap
– Wearing ESD shoes or ESD grounding straps in ESD areas with conductive flooring
● Only place electronic components, modules or devices on conductive surfaces (table with
ESD surface, conductive ESD foam, ESD packaging, ESD transport container).
NOTICE
Damage caused by loose plug connections and screw connections
Loose plug connections and screw connections can release themselves in operation.
● Ensure that all of the connectors and screws are correctly tightened or latched and inserted.
NOTICE
Damage caused by excessively low cooling clearances
Higher temperatures can occur if heat-generating components have excessively low cooling
clearances. This can damage the hardware.
● Ensure that the specified cooling clearances are complied with.
Service cases - hardware
4.1 Safety instructions for the hardware
Software and hardware
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Service Manual, 08/2018, 6FC5397-5DP40-6BA1
