COMe-cEL6 - User Guide, Rev.1.3
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Do not use an integrated RJ45 connector module with the center tap shorted together with
all 4 pairs at the center-tap transformer. This increases the common mode noise and may
create EMI. Kontron recommends adding a discrete common choke in series with each PHY
MDI differential line pairs If this type of integrated connector module (ICM) is chosen.
2.3.11.
COMe High-speed Serial Interfaces Overview
The COMe-cEL6 supports 12 HSIO lanes use for PCIe Gen 3.0, USB 3.1 Gen 2, SATA Gen 3 and GBE.
The following table lists the high-speed lane combinations.
HSIO
Lane
High-Speed IO
Description
USB 3.1 Gen 2 PCIE Gen 3.0 GbE
SATA 3.0
0
USB#0
USB 3.1 Gen 2#0 (10 Gb/s)
1
USB#1
USB 3.1 Gen 2 #1 (10 Gb/s)
2
PCIe-0#0
PCIe 3.0 lane
3
PCIe-0#1
PCIe 3.0 lane
4
PCIe-0#2
PCIe 3.0 lane
5
PCIe-0#3
PCIe 3.0 lane
6
PCIE-3#0
PCIe 3.0 lane
7
GbE#0
GBE (1 GbE or optional 2.5 GbE)
8
PCIe-1#0
PCIe 3.0 lane
9
Not connected
10
SATA#0
SATA Gen 3, 6 Gb/s
11
SATA#1
SATA Gen 3, 6 Gb/s
2.3.12.
Storage
The COMe-cEL6 support the following storage features.
eMMC
1x eMMC 5.1 NAND Flash (option)
Capacity: up to 64 GB pSLC or up to 128 GB MLC
Embedded EEPROM (EeeP)
1x Eeep (EEprom available on address A0h 8-bit / 50h 7-bit)
Pseudo SLC (pSLC) memory is reconfigured MLC and is half the capacity of MLC memory.
2.3.13.
BIOS/Software
The following table lists the supported BIOS and software features.
BIOS EFI
AMI Aptio V uEFI
Software
Demo Utility for KEAPI 3.0 usage for all supported OS
BIOS/ EFI Flash Utility for EFI shell, Windows 10 and Linux
BIOS/EFI Utility to configure PCIe mapping
BIOS/EFI Utility for users to implement Boot Logo and customized NVRA
