FEDL22660-01
ML22660
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Package Dimensions
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ML22660TB
Notes for heat sink type Package
This LSI adopts a heat sink type package to raise a radiation of heat characteristic. Be sure to design the land pattern corresponding
to the heat sink area of the LSI on a board, and solder each other. The heat sink area of the LSI solder open or GND on the board.
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Summary of Contents for LAPIS Semiconductor ML22660
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