Maintenance
R&S
®
TSME
56
User Manual 1514.6542.02 ─ 10
5
Maintenance
Instrument damage caused by cleaning agents
Cleaning agents contain substances such as solvents (thinners, acetone, etc.), acids,
bases, or other substances. Solvents can damage the front panel labeling, plastic
parts, or screens, for example.
Never use cleaning agents to clean the outside of the instrument. Use a soft, dry, lint-
free dust cloth instead.
Risk of instrument damage during transportation and shipment
Insufficient protection against mechanical and electrostatic effects during transportation
and shipment can damage the instrument.
●
Always make sure that sufficient mechanical and electrostatic protection is provi-
ded.
●
When shipping an instrument, the original packaging should be used. If this is not
available, allow for sufficient padding to prevent the instrument from moving around
inside the box. Pack the instrument in antistatic wrap to protect it from electrostatic
charging.
●
Secure the instrument to prevent any movement and other mechanical effects dur-
ing transportation.
Firmware updates
You do not have to update the firmware on the R&S
TSME manually. If necessary, firm-
ware updates are downloaded from the host PC application (R&S
ROMES, R&S
NES-
TOR, or R&S
ViCom) automatically when the connection is established (see
Self-Alignment
Usually, you do not have to perform any alignment on the R&S
TSME manually. How-
ever, the R&S
TSME automatically performs continuous self-alignment measurements
when the device is in connected mode and under control by the host PC, but not in
measurement mode (for example it is loaded in ROMES, but no measurement is being
performed, see also
Chapter 6.1, "Overview of Instrument Modes"
ing self-alignment, the R&S
TSME determines alignment values for the I/Q filter, ADC
offset and the I/Q imbalance. Note, however, that self-alignment is only performed for
antenna levels under -45
dBm.
