Quectel LCC Series, User Manual

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LCC/LGA Module Series
Module Secondary SMT User Guide
Module_Secondary_SMT_User_Guide 3 / 25
Content
About the Document ................................................................................................................................... 2
Content ......................................................................................................................................................... 3
Table Index ................................................................................................................................................... 4
Figure Index ................................................................................................................................................. 5
1 Introduction .......................................................................................................................................... 6
2 Information about Modules ................................................................................................................. 7
2.1. Surface-Mount Packaging Type ................................................................................................... 7
2.2. Packing Methods .......................................................................................................................... 7
3 Requirements on Chip Mounter ......................................................................................................... 8
3.1. Chip Mounter ................................................................................................................................ 8
3.2. Soldering Requirements .............................................................................................................. 8
4 Attentions for Manufacturing ............................................................................................................. 9
4.1. MSL and Moisture-proof Requirement ......................................................................................... 9
4.2. Stencil Design Requirements ..................................................................................................... 10
4.3. Mounting Process ...................................................................................................................... 18
4.3.1. Load Materials .................................................................................................................. 18
4.3.2. Automatic Placement ....................................................................................................... 19
4.4. Reflow Soldering ........................................................................................................................ 20
5 Desoldering ........................................................................................................................................ 22
6 Repair Instructions ............................................................................................................................ 24
7 Appendix Reference .......................................................................................................................... 25