LCC/LGA Module Series
Module Secondary SMT User Guide
Module_Secondary_SMT_User_Guide 16 / 25
SC66
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.60-0.80mm, while the
width should be reduced in a ratio of 1:0.85.
And the shape should be rectangle with
round chamfers.
3. For square pads in the center:
the stencil aperture area should be centered
with area reduced to 85% and designed with
round chamfers.
4. For round pads in the very center:
The aperture should be centered with area
reduced to 70%.
5. For pads at four corners:
the stencil aperture should be designed into
diagonal-patterned lines with 60% area of
the corresponding pad.
6. For the pad marked with red arrow:
The aperture should be centered with area
reduced to 70%-80%.
AG35
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. The stencil aperture area for the pads on
four sides should be centered with 75%-85%
area of corresponding pads, and should be
designed with round chamfers.
3. For pads at four corners (marked with red
boxes), the stencil aperture should be
reduced inward as marked by the white
arrows in the shape of diagonal-patterned
lines with 60% area of the corresponding
pad.
4. The stencil aperture for round GND pads in
the yellow box should be designed into 2
ovals with 60%-70% area of the pad, as
shown by the 2 grey parts in the bottom right
figure.
