LCC/LGA Module Series
Module Secondary SMT User Guide
Module_Secondary_SMT_User_Guide 17 / 25
AG15
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. The stencil aperture area for the pads on
four sides should be centered with area
reduced to 75%-85%, and should be
designed with round chamfers.
3. For pads at four corners, the aperture should
be centered and designed into diagonal-
patterned lines with 60% area of the
corresponding pad.
4. The aperture for round GND pads in the
center should be designed into 2 ovals with
60%-70% area of the pad, as shown by the
2 grey parts in the figure at the bottom.
FC10
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.15-0.18mm.
2. The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40mm, and the width
should be reduced in a ratio of 1:0.85, and
should be designed with round chamfers.
3. There is no need to design stencil apertures
for the arc-shaped pad in blue box.
FC20
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.15-0.18mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm while the
width should be reduced in a ratio of 1:0.85,
and should be designed in rectangle with
round chamfers.
3. For pads in the center:
The stencil aperture should be designed into
round with area reduced to 70%.
