LCC/LGA Module Series
Module Secondary SMT User Guide
Module_Secondary_SMT_User_Guide 13 / 25
four 1.00mm×0.65mm smaller apertures
shaped in 0.05mm square with round
chamfers, and with clearance of 0.25mm in
between.
4. The 12 pins in the very center are used for
R&D test and recommended to be kept
intact.
EC20/EC20 R2.0/
EC21/EC25/
EC20 R2.1
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm. The width
should be reduced in a ratio of 1:0.85. And
the shape should be rectangle with round
chamfers.
3. For GND pads in the center:
Design the stencil aperture for each pad into
four smaller 1.00mm×0.65mm apertures
shaped in 0.05mm square with round
chamfers, and with clearance of 0.25mm in
between.
4. Design round apertures with diameter of
0.70mm for the pads in the yellow box.
5. The 12 pins in the very center are used for
R&D test and recommended to be kept
intact.
EG25-G
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. For pads on four sides:
The stencil aperture should be centered
with area reduced to 75%-85% and the
shape should be rectangle with round
chamfers.
3. For pads in the center (in the red box):
Design four square apertures centered in
each pad of which the total area is 70% of
that of the pad.
4. The apertures for pads in the yellow box
should be centered with area reduced to
70% and the shape should be round.
