LCC/LGA Module Series
Module Secondary SMT User Guide
Module_Secondary_SMT_User_Guide 11 / 25
L10/L16/L20/L26/
L30/L50/L70/L76/
L80/L70-R/
L70-RL/L76-L/
L76B/L80-R/L86/
L96
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. The innermost edge of the aperture for each
single pad should be shifted outward by
0.10mm (refer to h1) and the outermost
edge should be shifted outward by
0.30-0.50mm (refer to h2).
BC66/BC68
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm, and the
width should be reduced in a ratio of 1:0.85.
The shape should be rectangle with round
chamfers.
3. For pads in the center:
The stencil aperture area for each single pad
should be 70% of that of the corresponding
pad and the shape should be round.
BC95/BC95-G
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm, and the
width should be reduced in a ratio of 1:0.85.
The shape should be rectangle with round
chamfers.
3. For pads in the center:
The stencil aperture area for each single pad
should be 70% of that of the corresponding
pad and the shape should be round.
