LCC/LGA Module Series
Module Secondary SMT User Guide
Module_Secondary_SMT_User_Guide 10 / 25
1. If baking is required, the module should be baked for 8 hours at 120ºC±5ºC.
2. Please take out the module from the package and put it on high-temperature resistant fixtures before
baking. All modules must be mounted within 24 hours after finishing baking, otherwise put them in the
drying oven.
4.2. Stencil Design Requirements
To ensure the solder paste is enough and soldering joints are reliable, the stencil should be partly
stepped-up on the top surface. And the stencil aperture for each single pad cannot be larger than
3.0mm×4.0mm and the exceeded part should be divided into smaller apertures with size less than
2.0mm×2.0mm by 0.3-0.5mm shelves. There is no need of opening for arc-shaped pad near regular pads;
if there is any component, a clearance of over 1mm should be left between outward end of the aperture
and the component.
The stencil design requirements for Quectel modules are shown in the table below. Diagrams in the table
are only typical examples of corresponding modules. Diagrams of different modules listed in the same
row may vary but the stencil requirements for them are identical.
Table 1: Stencil Design Requirements
Module
Diagram for Stencil Designs
Requirement Description
M10/M12/M72/
M80/M85/M95/
M66/M66-DS/
GC10
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. The innermost edge of the aperture for each
single pad should be shifted outward by
0.10mm (refer to h1) and the outermost
edge should be shifted outward by
0.30-0.50mm (refer to h2).
NOTES
