phyCORE-167CR/167CS
52
PHYTEC Meßtechnik GmbH 2002 L-527e_8
Removal of various components, such as the microcontroller and the
standard quartz, is not advisable given the compact nature of the
module. Should this nonetheless be necessary, please ensure that the
board as well as surrounding components and sockets remain
undamaged while desoldering. Overheating the board can cause the
solder pads to loosen, rendering the module inoperable. Carefully heat
neighboring connections in pairs. After a few alternations,
components can be removed with the solder-iron tip. Alternatively, a
hot air gun can be used to heat and loosen the bonds.
Summary of Contents for phyCORE-167CR
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Page 114: ...Published by PHYTEC Me technik GmbH 2002 Ordering No L 527e_8 Printed in Germany...