Temperature Multi-Input Device
Installation and Commissioning
2
017-
05
19
Equipotential Bonding of Devices in F2* Metal Housings
For electronic components in F2* metal housings in Zone 1 hazardous areas, suitable
equipotential bonding in accordance with IEC/EN 60079 is required. Therefore, the device is
designed as follows:
■
The shield (terminal S) of the intrinsically safe segment is internally connected to the
F2* metal housing.
■
The housing has a grounding point with a grounding screw. The grounding connection
must be secured against loosening and corrosion, e. g., by using tinned cable plates.
Shielding the R* Electronic Component in Intrinsically Safe Segments
The shield (terminal S) of the intrinsically safe segment is internally connected to the DIN
mounting rail.
3.2.4
Electrical Connection
Sensor Types Connecting to Temperature Multi-Input Devices
Figure 3.1
RTD, 2-wire technology
Figure 3.2
RTD, 3-wire technology
Figure 3.3
RTD, 4-wire technology
Figure 3.4
Millivolt
Note!
Ensure Shielding of the R* Electronic Component
Ensure that the DIN mounting rail is connected to the cabinet and the cabinet itself is
connected to the equipotential bonding.
+
-
+
-
L
+
-
L
H
H
L
mV