Wave Length:
647 - 677 nm (at DVD) / 775 - 815 nm (at CD)
Laser Power:
No hazardous radiation is emitted with the safety protection.
1.2. PRECAUTION OF LASER DIODE
CAUTION:
This unit utilizes a class III a laser. Visible laser radiation is emitted from
the optical pickup lens when the unit is turned on:
1. Do not look directly into the pickup lens.
2. Do not use optical instruments to look at the pickup lens.
3. Do not adjust the preset variable resistor on the optical pickup.
4. Do not disassemble the optical pickup unit.
5. If the optical pickup is replaced, use the manufactures specified
replacement pickup only.
6. Use of control or adjustment or performance of procedures other than
those specified herein may result in hazardous radiation exposure.
2. PREVENTION OF ELECTRO-STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits, some field-effect transistorsand semiconductor "chip" components.
The following techniques should be used to help reduce the incidence of component damage caused
by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your body by
touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging ESD wrist strap, whichshould
remove electrostatic charge for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place
the assembly on a conductive surface such as aluminum foil, to
prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4
Summary of Contents for PV-D4733S-K
Page 15: ...R1522 ERJ6GEYJ103V MGF CHIP 1 10W 10K 15 ...
Page 45: ...Fig 16 1 Fig 16 2 6 1 4 2 REMOVAL OF CSP IC Fig 16 3 45 ...
Page 46: ...6 1 4 3 INSTALLATION OF CSP IC Fig 16 4 46 ...
Page 47: ...Fig 16 5 47 ...
Page 48: ...6 1 4 4 CSP IC LOCATION Fig 16 6 48 ...
Page 134: ...Fig D2 22 ...
Page 139: ...5 2 2 Inner Parts Location Fig J1 1 27 ...
Page 140: ...5 2 3 EJECT Position Confirmation Fig J1 2 28 ...
Page 147: ...5 2 8 Capstan Motor Unit Fig J6 5 2 9 T Loading Arm Unit and S Loading Arm Unit Fig J7 1 35 ...
Page 152: ...5 3 CASSETTE UP ASSEMBLY SECTION 5 3 1 Top Plate Wiper Arm Unit and Holder Unit Fig K1 1 40 ...
Page 168: ...10 2 MECHANISM BOTTOM SECTION 56 ...
Page 169: ...10 3 CASSETTE UP COMPARTMENT SECTION 57 ...
Page 170: ...10 4 CHASSIS FRAME AND CASING PARTS SECTION 58 ...
Page 171: ...10 5 PACKING PARTS AND ACCESSORIES SECTION 59 ...
Page 187: ...75 ...
Page 192: ...80 ...
Page 194: ...82 ...
Page 202: ...90 ...