Chapter 4. Parts Replacement
26
DigitalFlow™ XGF868i Service Manual
4.6 Installing an Option Card
The XGF868i flowmeter can accommodate up to two option cards. A communication card may be installed in
Slot 2
and a variety of I/O option cards are available for installation in
Slot 1
.
To install an option card, see
Illustrations 9, 10 and 11
in
and complete the following steps:
1.
Complete the steps in
“Removing the Circuit Board Assembly” on page 22
.
2.
Remove the terminal board from the main board/power supply board subassembly by completing Steps 1-3 in
“Replacing the User Program” on page 25
3.
Remove the screw from the angle bracket on the main board, as shown in
Illustration 11
in
Note:
Do not lose the
nylon washer
located between the small
angle bracket
on the terminal board and the main
board.
4.
If necessary, remove any option card (and optional I/O heat sink) currently in use.
5.
There is a 36 pin connector (P2) and a 30 pin connector (P1) on the rear of the interconnect board. The option
cards must be plugged into these connectors.
a.
To install a
communication card into Slot 2
, orient the option card so that its 36 pin connector is positioned over
connector P2 on the interconnect board. Then, firmly seat the card into its connector. When properly installed, the
side of the option card with the 36-pin connector must face the center of the interconnect board, and the edge of
the option card must not overhang the edge of the interconnect board.
b.
To install an
I/O option card with optional heat sink into Slot 1
, orient the option card so that its 30 pin
connector is positioned over connector P1 on the interconnect board. Then, firmly seat the card into its
connector. When properly installed, the side of the option card with the 30-pin connector must face away
from the center of the interconnect board, and the edge of the option card must not overhang the edge of
the interconnect board. (However, the optional heat sink will extend beyond the edge.)
Note:
To attach an optional heat sink to an I/O option card, see “Attaching an Optional Heat Sink to an I/O Option
Card” on page 26. When the XGF868i includes both an I/O board (Slot 1) and an option board (Slot 2), the
two boards must be attached to each other with the hardware shown in
Illustration 10
in
.
Pre-attach the nylon washer to the screw before inserting the boards into the assembly.
4.6.1 Attaching an Optional Heat Sink to an I/O Option Card
If you need to attach an optional heat sink to an I/O option card (the TI, TR, FI or FR options in Appendix B of the
Startup
Guide)
, refer to
Illustration 9
in
and complete the following steps:
1.
Orient the thermal heat pad(s) to the heat sink as shown in
and apply it to the heat sink.
2.
Loosely attach the aluminum backplate to the I/O heat sink with three screws, lock washers and flat washers.
Note:
The following step applies only to the TR and FR option cards. Otherwise, proceed to step 4.
3.
If you have an optional heat sink bridge, attach it to the I/O heat sink with two screws, lock washers, flat washers
and nuts.
4.
Attach the assembled heat sink by straddling the power supply components on the option card with the
aluminum plate to the left (inside) and the heat sink to the right (outside).
5.
Tighten the three screws (step 2) to secure the aluminum backplate to the heat sink.
Complete the option card installation by proceeding to
“Assembling the Circuit Board Assembly” on page 26
.
4.7 Assembling/Installing the Circuit Board Assembly
Most of the parts replacement procedures described in this chapter require removal of the circuit board assembly
from the electronics enclosure. Furthermore, most of the procedures require varying degrees of disassembly of the
circuit board assembly. See
and follow the instructions in this section to assemble the circuit
board assembly and/or to install it in the electronics enclosure.
4.7.1
Assembling the Circuit Board Assembly
If the circuit board assembly has been disassembled to any degree, complete the steps below. Otherwise proceed
directly to
“Installing the Circuit Board Assembly” on page 28
. See
and complete the following
steps:
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