CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS
User's Manual U14826EJ5V0UD
198
Table 23-1. Surface Mounting Type Soldering Conditions (2/2)
µ
PD78E9860AMC-5A4: 20-pin plastic SSOP (7.62 mm (300))
µ
PD78E9861AMC-5A4: 20-pin plastic SSOP (7.62 mm (300))
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less, Exposure limit: 3 days
Note
(after that, prebake
at 125
°
C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less, Exposure limit: 3 days
Note
(after that, prebake at
125
°
C for 10 hours)
VP15-103-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature), Exposure
limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
WS60-103-1
Partial heating
Pin temperature: 300
°
C max. Time: 3 seconds max. (per pin row)
−
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering method together (except for partial heating).