57
µ
PD754202, 754202(A)
15. RECOMMENDED SOLDERING CONDITIONS
The
µ
PD754202 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 15-1. Surface Mounting Type Soldering Conditions
µ
PD754202GS-
×××
-BA5
: 20-pin plastic SOP (300 mil, 1.27-mm pitch)
µ
PD754202GS-
×××
-GJG
: 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
µ
PD754202GS(A)-
×××
-BA5 : 20-pin plastic SOP (300 mil, 1.27-mm pitch)
µ
PD754202GS(A)-
×××
-GJG : 20-pin plastic shrink SOP (300 mil, 0.65-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below
IR35-00-2
(at 210
°
C or higher), Number of reflow processes: Twice or less
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below
VP15-00-2
(at 200
°
C or higher), Number of reflow processes: Twice or less
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below,
WS60-00-1
Number of flow processes: 1
Preheating temperature: 120
°
C or below (package surface temperature)
Partial heating
Pin temperature: 300
°
C or below, Time: 3 seconds or below (per side of device)
—
Caution
Do not use different soldering methods together (except for partial heating).
Summary of Contents for Mu754202
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