USER MANUAL
SOLDERABILITY TESTER
METRONELEC
V2.0
–
10/2021
6 Avenue Eiffel - 78420 Carrières-sur-Seine
Tél : 01 30 15 20 00
Web :
http://www.metronelec.com| Mail : [email protected]
Page
81
sur
83
Installation of the software
The first installation is made by METRONELEC or by the official sales representatives. The
updating of the software is made by the users, according to the following procedure :
1.
Start WINDOWS software
2.
Place the CD into the drive
3.
Double click on INSTALL
4.
Follow instruction on screen
5.
Once the installation is finished, remove the CD from the drive and keep it as a
backup.
Note : if we send you an update of the software by E-mail, the file will be zipped.
Copy the file into a temporary directory, and uncompress the zip file to obtain the software
for the MENISCO ST88 NEO.
Daily Maintenance
Solder bath
Check the thermocouple is well dipped in the bath. Even if the bath is automatically
scrapped, some drosses need to be removed by the operator during a long time without
scrapping.
Check cleanliness of the height gauge unit where the component touches the paddle.
Solder globule
Change at every test t
he solder globule used, don’t let the globule pads without alloy on it.
Use cotton bud to remove the previous performs and to flux the new one.
Check cleanliness of the height gauge unit where the component touches the paddle.
ANNEX A
PCB wetting test
First, keep always in mind the basic equation :
F
measured
= F
wetting
–
F
buoyancy
F
measured
=
γ
LV
. p . Cos(
θ
)
–
V .
ρ
. g
Where :
•
γ, GammaLV is the interaction between the liquid and gaseous phases, function of
the couple alloy / flux. Typically, GammaLV # 400 mN/m