USER MANUAL
SOLDERABILITY TESTER
METRONELEC
V2.0
–
10/2021
6 Avenue Eiffel - 78420 Carrières-sur-Seine
Tél : 01 30 15 20 00
Web :
http://www.metronelec.com| Mail : [email protected]
Page
25
sur
83
TEMPERATURE
Input the temperature test in °C directly or click on the arrows to change the value degree
by degree (0 to 500).
Respect a certain margin above the liquidus alloy to avoid delay in wetting. (50 to 35 °C).
DENSITY
Input the density in mg/mm3, be sure of the alloy density at the temperature set or click on
the arrow (0 to 10.00)
IMMERSION TIME
Input the immersion time in second or use the mouse to select value (3 to 90).
The wetting takes time, few seconds to let the equilibrium to occur. If there is no equilibrium
in this time, there is probably a mistake…
3 to 5 second for a component wetting, 5 to 10 for a pcb test and much more for a
dewetting.
PRE HEATING TIME
In case of pre heating requirement, input here the duration of the pre heating in second (0
to 90)
The pre heating is done few millimeters above the bath level.
Nota : if you select "Time = 0" the solderability measurement is made without Pre-heat
process.
PRE HEATING HEIGHT
As for pre heating time, we input here the height above the level of the bath in mm (3 to
30).
SENSITIVITY
The sensitivity is automatically set by the software according to the dimensions of the
measured part of the component but the operator can force it if wanted.
IMMERSION DEPTH
Input the immersion depth in tenth of mm (0.1 to 10) or use the mouse on the arrows to
change the value.
This depth is a compromise between good thermal exchange (function of the surface in
contact), shape / height of the sample and wettable area.
We use generally 1 to 3 mm for traditional components or 0.1 to 0.5 mm for SMD
components.
IMMERSION SPEED
Input the immersion speed in mm or use the mouse on the arrows to change the value(1 to
50). Immersion speed is a compromise between assembly process (wave, iron, reflow,..),
the component type and the immersion depth to have a minimum immersion time.