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BGA-3500 Series Manual 5/01
The CSP-3500 systems employ a removable 1.5X lens element to provide a maximum four-sided view of
18mm x 18mm (0.71” x 0.71”) with no corner overlay required. The zoom lens magnification has a
range of 15X to 75X. The 1.5X element may be removed if a larger component is being placed. In addi-
tion, a 2X
lens element is available to enable placement of extremely small CSP components.
Shipping Data
BGA/CSP Rework System
Size
(L) 41 inches x (W) 30 inches x (H) 25 inches
Weight
185 lbs
Cube Weight 185 International
157 Domestic
Monitor
Supplied locally and specifications may vary
Size
(L) 22 inches x (W) 22 inches X (H) 22 inches
Weight
45 lb
CAUTION!
When operating this equipment, please exercise extreme caution and common sense. If this unit is used
in a manner that it is not intended for, serious personal injury may occur. Please read this operators
manual thoroughly prior to use.
I. INTRODUCTION AND GENERAL OVERVIEW
Thank you for your purchase of a Metcal BGA/CSP-3500 Series Rework System. Each unit has been
inspected thoroughly by Metcal prior to shipment and, with proper maintenance, will give you years of
reliable performance.
Your USER GUIDE is a valuable resource. It explains the system’s options, features, specifications and
outlines the correct operation of your BGA/CSP-3500 Rework System. If any problems should occur dur-
ing setup or operation of your system, contact your local Metcal Representative or Metcal’s Applications
Engineering Department at (650) 325-3291, or e-mail to [email protected].
This Metcal BGA/CSP-3500 Series Rework System provides both accurate component placement and
specifically tailored reflow profiles (through Metcal’s patented single component Micro Oven™) in a user
friendly, single platform rework system.
The challenges of BGA and Fine-Pitch QFP component placement, including the inability to easily
inspect placement accuracy (with BGAs in particular), call for a solution that allows for simultaneous
viewing of PC board pads and component leads or balls for accurate placement. The BGA/CSP-3500
fills this need with quick, accurate, placement using an optical system with split-field, dual image over-
lay technology.
The image of the BGA solder balls is overlaid with the image of the PC board pattern. After coarse align-
ment, the corners of the image are brought together. The image is then viewed on the high-resolution
monitor and fine X, Y and theta adjustment, at up to 50X magnification, can be performed using the
micrometers. Finally, the part is placed and the vacuum is released automatically.
