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BGA-3500 Series Manual 5/01
14. With the component placed onto PCB, the vacuum will automatically deactivate when the vacuum head
senses pressure produced by the component contacting the PCB. If you are controlling the vacuum by
the foot switch, you can deactivate the vacuum by depressing the foot switch.
15. Rotate the Z-Axis knob clockwise until the vacuum head is in the top position.
16. Now that the placement process is complete, check the component for proper position and orientation
prior to reflow.
17. After the component has been accurately placed into the correct position, pull the board holder knob
towards you and slide the board holder until it locks into place underneath the reflow head. Ensure
that the component sits directly underneath the BGA Micro Oven. If necessary, fine adjustments can be
made by rotating the micrometers on the board holder.
MICRO OVEN REFLOW SYSTEM:
IMPORTANT: This section will explain the steps required to program a Component Placement
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1. Select the correct placement profile that corresponds with your application.
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2. Select the appropriate Micro Oven or SMT nozzle that corresponds with the component that you wish
to remove and install onto the BGA-3528 head assembly.
Prior to installation, the nozzle lock ring should be rotated counterclockwise, before inserting (or remov-
ing) the nozzle. The nozzles are indexed and the small notch or oval hole should be facing the operator.
After inserting the nozzle in an upward position, rotate the nozzle lock ring clockwise to secure. If
using a SMT nozzle, be sure to use the optional BGA-NA nozzle adapter, which is secured into the
BGA-3528 Micro Oven head assembly in a similar fashion. SMT nozzles are threaded and simply screw
into the nozzle adapter.
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3. Position the Micro Oven Nozzle over the center of the component using the X and Y micrometers for
fine adjustments.
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4. Press the start button or click on the start icon to begin the reflow cycle. The system will cycle through
the complete profile and automatically stop at the end.
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5. Raise the nozzle assembly off of the PCB by rotating the “Z” axis lever on the reflow arm clockwise.
The BGA component that you have just soldered is now ready for post reflow inspection.
Component Removal:
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1. Select the correct removal profile that corresponds with your application.
1
2. Select the appropriate Micro Oven or SMT nozzle that corresponds with the component that you wish
to remove and install onto the BGA-3528 head assembly.
Prior to installation, the nozzle lock ring should be rotated counterclockwise before inserting (or remov-
ing) the nozzle. The nozzles are indexed and the small notch or oval hole should be facing the operator.
After inserting the nozzle in an upward position, rotate the nozzle lock ring clockwise to secure. If
using a SMT nozzle, be sure you are using the optional BGA-NA nozzle adapter, which is secured into
the BGA-2028 Micro Oven head assembly in a similar fashion. SMT nozzles are threaded and simply
screw into the nozzle adapter.
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3. Install a vacuum cup onto the vacuum tube in the BGA head assembly.
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4. Depress the vacuum solenoid on the top of the BGA head assembly until it “locks” in the down posi-
tion. Do not use excessive force. Unlock the “Z” axis locking knob on the front of the BGA head assem-
bly so that the vacuum tube moves freely in the “Z” axis.
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5. Rotate the “Z” axis lever on the reflow arm (right hand side of the unit) so that the nozzle makes a
complete seal on the board or reaches the stop position.
