MeiG Smart product technical information
SLM500
Hardware Design Guide
Page 69
7.2. Recommended Soldering Furnace Temperature Curve
Figure 49: Module recommended soldering furnace temperature curve
7.3. Humidity Sensitivity (MSL)
The SLM500 module meets moisture sensitivity level 3. The dry package is subjected to
the J-STD-020C specification in accordance with the IPC/JEDEC standard under ambient
conditions of temperature <30 degrees and relative humidity <60%. Under ambient
conditions of temperature <40 degrees and relative humidity <90%, the shelf life is at least 6
months without unpacking. After unpacking, Table 22 lists the shelf life of the modules for
different moisture sensitivity levels.
Table 7.1: Humidity sensitivity level distinction
Grade
Factory environment
≦
+30℃/60%RH
1
Indefinite quality in the environment
≦
+30℃/85% RH Under conditions
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Use it after forced baking. After baking, the module must be patched within the
