MeiG Smart product technical information
SLM500
Hardware Design Guide
Page 70
time limit specified on the label.
After unpacking, the SMT patch should be taken within 168 hours under ambient conditions
of <30 degrees and relative humidity <60%. If the above conditions are not met, baking is
required. Note: Oxidation risk: Baking SMD packages can cause metal oxidation and, if
excessive, can cause solderability problems during board assembly. The temperature and time
of the SMD package are baked, thus limiting solderability considerations. The accumulation of
baking time should be no more than 96 hours at temperatures above 90°C and as high as 125°C
7.4. Baking Requirements
Due to the humidity sensitivity of the module, the SLM500 should be thoroughly baked
prior to reflow soldering, otherwise the module may cause permanent damage during reflow
soldering. The SLM500 should be baked for 192 hours in a cryogenic vessel at 40°C +5°C/-
0°C and a relative humidity of less than 5%, or in a high temperature vessel at 80°C±5°C.Bake
for 72 hours. Users should note that the tray is not resistant to high temperatures. The user
should take the module out of the tray for baking, otherwise the tray may be damaged by high
temperature.
Table 7.2: Baking requirements:
Baking temperature
Humidity
Baking time
40°C±5°C
<5%
192 hours
120°C±5°C
<5%
4 hours
