MeiG Smart product technical information
SLM500
Hardware Design Guide
Page 46
inside the chip, which can ensure that HS_DET is low when connected with HPH_L, if the user
will HS_DET and HPH_R To connect, please reserve a 1K pull-down resistor on HPH_R.
3 The standard of the headphone interface is the European standard OMPT. If you need to design
the American standard CTIA interface, you need to swap the GND and MIC signals for the
network. If you want to be compatible with both headset standards, you need an external
dedicated chip, such as the TI-TS3A226AE.
4.8.4.Speaker Interface Circuit
The module integrates a Class-D audio amplifier with an output power of 800mW and an
output signal of SPKR_OUT_P / SPKR_OUT_M.
4.24
：
Recommended circuit with Internal audio amplifier
4.8.5.I2S Interface
There are one sets of GPIO-compatible I2S interfaces inside the module. The pins used by
this function are as follows:
Name
Pin
Intput/Output
Description
GPIO88
264
O
I2S1 Data out
GPIO87
105
O
I2S1 WS
GPIO86
239
I
I2S1 Data in
GPIO85
265
O
I2S1 SLK
4.9. USB Interface
The SLM500 supports a USB 2.0 High speed interface. It must control the 90 ohm
differential impedance during Layout and control the external trace length.
The module supports OTG function.
The voltage input range during charging is as follows:
Table 4.9: Voltage input range during charging
Name
Description
Minimum
Typical
Maximum
Unit
VBUS
Input range
4
-
6.3
V
