REL1.1
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iWave Systems Technologies Pvt. Ltd.
RZ/G1E SODIMM Development Platform Hardware User Guide
Pin
No.
SODIMM Edge Connector Signal
Name
Signal Type/
Termination
Description
99
HSCIF2_HRX(GP0_8)
O, 3.3V CMOS
NC in carrier board.
HSCIF2 interface serial data receiver.
This pin is connected from Expansion Header
J12 Pin 04.
Note: In RZ/G1E SOM same signal is connected
to Wi-Fi and Bluetooth Module.
100
HSCIF2_HRTS(GP0_12)
I, 3.3V CMOS
HSCIF2 interface ready to send data.
This pin is connected to Expansion Header J12
Pin 06.
101
HSCIF2_HCTS(GP0_11)
O, 3.3V CMOS
HSCIF2 interface clear to send data.
This pin is connected to Expansion Header J12
Pin 05.
102
HSCIF1_HTX(GP4_9)
I, 3.3V CMOS
HSCIF1 interface serial data transmitter.
This pin is connected to Data UART Header J11
Pin 04.
103
HSCIF1_HRX(GP4_8)
O, 3.3V CMOS
HSCIF1 interface serial data receiver.
This pin is connected from Data UART Header
J11 Pin 05.
104
ETH_REF_CLK/VI1_DATA4(GP5_1
6)¹
O, 3.3V CMOS
VIN1 Parallel Camera data4.
This pin is connected from camera connector
J6.
105
SD0_CD(GP6_6)
O, 3.3V CMOS
SD0 Card Detect.
This pin is connected from Micro SD connector
J19 for card detection.
106
VIN_3V3
O, 3.3V Power
Supply Voltage.
107
SD0_DAT0(GP6_2)
IO, 3.3V CMOS
SD0 Data0.
This pin is connected to Micro SD connector
J19.
108
SD0_CMD(GP6_1)
IO, 3.3V CMOS
SD0 command.
This pin is connected to Micro SD connector
J19.
109
SD0_CLK(GP6_0)
I, 3.3V CMOS
SD0 clock.
This pin is connected to Micro SD connector
J19.
110
ETH_TX_EN/VI1_DATA6(GP5_18)
¹
O, 3.3V CMOS
VIN1 Parallel Camera Data6.
This pin is connected from camera connector
J6.
111
SD0_DAT1(GP6_3)
IO, 3.3V CMOS
SD0 Data1.
This pin is connected to Micro SD connector
J19.