Thermal Management Specifications
128
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
Table 7-3
. The processor may be delivered under
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
1.
Please refer to
Table 5-23
for discrete points that constitute the thermal profile.
2.
Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the
Intel®
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide
for
system and environmental implementation details.
Figure 5-23. Tcase: 4-Core 95W Thermal Profile 1U
Figure 5-24. DTS: 4-Core 95W Thermal Profile 1U
