Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
109
Datasheet Volume One
Thermal Management Specifications
5.1.3.3
8/6-Core 130W Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
Section 7.8.1
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
Table 7-3
. The processor may be delivered under
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
80
63.2
72.8
85
64.0
74.2
90
64.8
75.6
95
65.6
77.0
100
66.4
78.4
105
67.2
79.8
110
68.0
81.2
115
68.8
82.6
120
69.6
84.0
125
70.4
85.4
130
71.2
86.8
135
72.0
88.2
Table 5-6.
Tcase: 8/6-Core 130W Thermal Specifications, Workstation/Server Platform
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
130
5
See
Figure 5-5
and
Table 5-7
.
1, 2, 3, 4, 5
Table 5-5.
8-Core 135W Thermal Profile Table 2U (Sheet 2 of 2)
Power (W)
Maximum T
CASE
(°C)
Maximum DTS (°C)