Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
119
Datasheet Volume One
Thermal Management Specifications
5.1.3.7
8-Core 70W Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
Section 7.8.1
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
Table 7-3
. The processor may be delivered under
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Please refer to
Table 5-15
for discrete points that constitute the thermal profile.
2.
Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the
Intel®
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide
for
system and environmental implementation details.
85
70.8
80.6
81.5
90
71.9
82.3
83.3
95
73.0
83.9
85.0
Table 5-14. Tcase: 8-Core 70W Thermal Specifications 1U
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
70
5
See
Figure 5-15
and
Table 5-15
1, 2, 3, 4, 5
Table 5-13. 8/6-Core 95W Thermal Profile Table 1U (Sheet 2 of 2)
Power (W)
Maximum T
CASE
(°C)
Maximum DTS (°C)
8/6-core
8-core
6-core
Figure 5-15. Tcase: 8-Core 70W Thermal Profile 1U
