Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
5
Datasheet Volume One
7
Electrical Specifications
......................................................................................... 151
7.1
Processor Signaling ......................................................................................... 151
7.1.1
System Memory Interface Signal Groups ................................................. 151
7.1.2
PCI Express* Signals ............................................................................ 151
7.1.3
DMI2/PCI Express* Signals.................................................................... 151
7.1.4
Intel QuickPath Interconnect (Intel QPI) .................................................. 151
7.1.5
Platform Environmental Control Interface (PECI) ...................................... 152
7.1.6
System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)....................... 152
7.1.7
JTAG and Test Access Port (TAP) Signals ................................................. 153
7.1.8
Processor Sideband Signals ................................................................... 153
7.1.9
Power, Ground and Sense Signals........................................................... 153
7.1.10 Reserved or Unused Signals................................................................... 158
7.2
Signal Group Summary .................................................................................... 158
7.3
Power-On Configuration (POC) Options............................................................... 162
7.4
Fault Resilient Booting (FRB)............................................................................. 163
7.5
Mixing Processors............................................................................................ 163
7.6
Flexible Motherboard Guidelines (FMB) ............................................................... 164
7.7
Absolute Maximum and Minimum Ratings ........................................................... 164
7.7.1
Storage Conditions Specifications ........................................................... 165
7.8
DC Specifications ............................................................................................ 166
7.8.1
Voltage and Current Specifications.......................................................... 167
7.8.2
Die Voltage Validation ........................................................................... 173
7.8.3
Signal DC Specifications ........................................................................ 174
7.9
Waveforms..................................................................................................... 180
7.10 Signal Quality ................................................................................................. 181
7.10.1 DDR3 Signal Quality Specifications ......................................................... 182
7.10.2 I/O Signal Quality Specifications............................................................. 182
7.10.3 Intel QuickPath Interconnect Signal Quality Specifications.......................... 182
7.10.4 Input Reference Clock Signal Quality Specifications................................... 182
7.10.5 Overshoot/Undershoot Tolerance............................................................ 182
8
Processor Land Listing
........................................................................................... 187
8.1
Listing by Land Name ...................................................................................... 187
8.2
Listing by Land Number ................................................................................... 212
9
Package Mechanical Specifications
........................................................................ 237
9.1
Package Mechanical Drawing............................................................................. 237
9.2
Processor Component Keep-Out Zones............................................................... 241
9.3
Package Loading Specifications ......................................................................... 241
9.4
Package Handling Guidelines............................................................................. 241
9.5
Package Insertion Specifications........................................................................ 241
9.6
Processor Mass Specification............................................................................. 242
9.7
Processor Materials.......................................................................................... 242
9.8
Processor Markings.......................................................................................... 242
10
Boxed Processor Specifications
............................................................................. 243
10.1 Introduction ................................................................................................... 243
10.1.1 Available Boxed Thermal Solution Configurations ...................................... 243
10.1.2 Intel Thermal Solution STS200C
(Passive/Active Combination Heat Sink Solution) ...................................... 243
10.1.3 Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions).................................... 244
10.2 Mechanical Specifications ................................................................................. 245
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ........ 245
10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS) ...... 254
10.3 Fan Power Supply [STS200C]............................................................................ 254
10.3.1 Boxed Processor Cooling Requirements ................................................... 255
10.4 Boxed Processor Contents ................................................................................ 257
