Thermal Management Specifications
114
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
5.1.3.5
8-Core 115W Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
Section 7.8.1
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
Table 7-3
. The processor may be delivered under
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
85
56.2
68.9
90
57.1
70.5
95
57.9
72.1
100
58.8
73.7
105
59.7
75.3
110
60.5
76.9
115
61.4
78.5
120
62.3
80.1
125
63.1
81.8
130
64.0
83.4
Table 5-10. Tcase: 8-Core 115W Thermal Specifications 1U
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
115
5
See
Figure 5-10
and
Table 5-11
1, 2, 3, 4, 5
Table 5-9.
6-Core 130W 1S WS Thermal Profile Table (Sheet 2 of 2)
Power (W)
Maximum T
CASE
(°C)
Maximum DTS (°C)