Intel DB75EN, Specification

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Contents
ix
4 Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 73
4.2 BIOS Beep Codes ............................................................................. 73
4.3 Front-panel Power LED Blink Codes ..................................................... 74
4.4 BIOS Error Messages ........................................................................ 74
4.5 Port 80h Power On Self Test (POST) Codes .......................................... 75
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 81
5.1.1 Safety Standards................................................................... 81
5.1.2 European Union Declaration of Conformity Statement ................ 82
5.1.3 Product Ecology Statements ................................................... 83
5.1.4 China RoHS .......................................................................... 86
5.1.5 EMC Regulations ................................................................... 87
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 89
5.1.7 Regulatory Compliance Marks (Board Level) ............................. 90
5.2 Battery Disposal Information .............................................................. 91
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and DIMM Configuration ............................................ 21
4. Back Panel Audio Connectors ............................................................. 26
5. LAN Connector LED Locations ............................................................. 28
6. Thermal Sensors and Fan Headers ...................................................... 30
7. Location of the Intel ME “M” State LED ................................................ 33
8. Location of the Standby Power LED ..................................................... 40
9. Detailed System Memory Address Map ................................................ 42
10. Back Panel Connectors ...................................................................... 44
11. Component-side Connectors and Headers ............................................ 45
12. Connection Diagram for Front Panel Header ......................................... 52
13. Connection Diagram for Front Panel USB 2.0 Headers ........................... 54
14. Location of the Jumper Block ............................................................. 55
15. Intel MEBX Reset Header ................................................................... 56
16. Board Dimensions ............................................................................. 57
17. Localized High Temperature Zones ..................................................... 60
18. Intel Desktop Board DB75EN China RoHS Material Self
Declaration Table .............................................................................. 86
Tables
1. Specification Changes or Clarifications ................................................... iii
2. Feature Summary ............................................................................. 11
3. Components Shown in Figure 1 .......................................................... 14
4. Supported Memory Configurations ...................................................... 19
5. Audio Jack Support ........................................................................... 25