Intel DB75EN, Specification

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Product Description
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1.8 Audio Subsystem
The board supports the Intel
®
High Definition Audio (Intel
®
HD Audio) subsystem. The
audio subsystem consists of the following:
•
Intel B75 Express Chipset
•
Realtek ALC662 audio codec
The audio subsystem has the following features:
•
Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
•
Front panel Intel HD Audio and AC ’97 audio support.
•
3-port analog audio out stack.
•
A signal-to-noise (S/N) ratio of 95 dB.
•
Windows 7 Ultimate certification.
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack Micro-
phone
Headphones
Line Out
(Front Spks)
Line In
(Surround)
Mic-In
(Center/Sub)
Front panel – Green Default
Front panel – Pink Default
Back panel – Blue Default
(ctrl panel)
Back panel – Green (ctrl panel) Default
(ctrl panel)
Back panel – Pink Default
(ctrl panel)
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16